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Technical Data Sheet
PartsTable / COMPONENT / 2764-200
2764-200 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.435 INCHES MINIMUM AND 1.485 INCHES MAXIMUM IN, overall_height: 0.325 INCHES NOMINAL IN, features_provided: ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND LOW CURRENT AND W/ENABLE AND HIGH SPEED AND MONOLITHIC AND HERMETICALLY SEALED, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-243-0707, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
2764-200
NSN: 5962-01-243-0707
FSC: 5962
CAGE: 00779 — TE CONNECTIVITY CORPORATION (USA)
SPECIFICATIONS
body_width0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length1.435 INCHES MINIMUM AND 1.485 INCHES MAXIMUM IN
overall_height0.325 INCHES NOMINAL IN
features_providedULTRAVIOLET ERASABLE AND PROGRAMMABLE AND LOW CURRENT AND W/ENABLE AND HIGH SPEED AND MONOLITHIC AND HERMETICALLY SEALED
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 125.0 CELSIUS DEGC
operating_temp_range+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern16 INPUT
inclosure_configurationDUAL-IN-LINE
NSN5962-01-243-0707
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 2764-200 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
FEATURES PROVIDED: ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND LOW CURRENT AND W/ENABLE AND HIGH SPEED AND MONOLITHIC AND HERMETICALLY SEALED
•
TERMINAL SURFACE TREATMENT: SOLDER
•
MEMORY DEVICE TYPE: ROM
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.6 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
•
TERMINAL TYPE AND QUANTITY: 28 PRINTED CIRCUIT
•
STORAGE TEMP RANGE: -65.0 TO 125.0 CELSIUS DEGC
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
FEATURES PROVIDEDULTRAVIOLET ERASABLE AND PROGRAMMABLE AND LOW CURRENT AND W/ENABLE AND HIGH SPEED AND MONOLITHIC AND HERMETICALLY SEALED
TERMINAL SURFACE TREATMENTSOLDER
MEMORY DEVICE TYPEROM
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.6 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL TYPE AND QUANTITY28 PRINTED CIRCUIT
STORAGE TEMP RANGE-65.0 TO 125.0 CELSIUS DEGC
OVERALL HEIGHT0.325 INCHES NOMINAL IN
INCLOSURE CONFIGURATIONDUAL-IN-LINE
OUTPUT LOGIC FORMN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
BODY WIDTH0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
VERIFIED SUBSTITUTES & CROSS-REFERENCES 13
120R0C36CLASS3Interchangeable
interchangeable cross-reference
interchangeable
SC1204-41Interchangeable
interchangeable cross-reference
interchangeable
D27642Interchangeable
interchangeable cross-reference
interchangeable
55660-90047Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
AM2764-2DCInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 2764-200?
2764-200 is a MICROCIRCUIT,MEMORY.
What parts can replace 2764-200?
There are 13 known substitutes for 2764-200: 120R0C36CLASS3, SC1204-41, D27642 and 10 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 2764-200?
2764-200 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-243-0707. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
PartsTable Design LLC · partstable.com
Last verified: July 2026