The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.600 INCHES MAXIMUM IN, body_height: 0.175 INCHES MAXIMUM IN, body_length: 1.485 INCHES MAXIMUM IN, bit_quantity: 65536, word_quantity: 8092, features_provided: HIGH SPEED AND PROGRAMMABLE AND ERASABLE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-214-0920, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.600 INCHES MAXIMUM IN |
| body_height | 0.175 INCHES MAXIMUM IN |
| body_length | 1.485 INCHES MAXIMUM IN |
| bit_quantity | 65536 |
| word_quantity | 8092 |
| features_provided | HIGH SPEED AND PROGRAMMABLE AND ERASABLE |
| output_logic_form | METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 13 INPUT |
| NSN | 5962-01-214-0920 |
| FEATURES PROVIDED | HIGH SPEED AND PROGRAMMABLE AND ERASABLE |
| TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY LENGTH | 1.485 INCHES MAXIMUM IN |
| INCLOSURE MATERIAL | CERAMIC |
| OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
| BODY WIDTH | 0.600 INCHES MAXIMUM IN |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| BODY HEIGHT | 0.175 INCHES MAXIMUM IN |