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Technical Data Sheet
PartsTable / COMPONENT / AM2764-2DC
AM2764-2DC ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.600 INCHES MAXIMUM IN, body_height: 0.175 INCHES MAXIMUM IN, body_length: 1.485 INCHES MAXIMUM IN, bit_quantity: 65536, word_quantity: 8092, features_provided: MONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-232-5450, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
AM2764-2DC
NSN: 5962-01-232-5450
FSC: 5962
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)
SPECIFICATIONS
body_width0.600 INCHES MAXIMUM IN
body_height0.175 INCHES MAXIMUM IN
body_length1.485 INCHES MAXIMUM IN
bit_quantity65536
word_quantity8092
features_providedMONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE
output_logic_formMETAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern15 INPUT
NSN5962-01-232-5450
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN AM2764-2DC MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
OPERATING TEMP RANGE: +0.0 TO 70.0 CELSIUS DEGC
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
TERMINAL TYPE AND QUANTITY: 28 PRINTED CIRCUIT
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.600 INCHES MAXIMUM IN
•
FEATURES PROVIDED: MONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE
•
INPUT CIRCUIT PATTERN: 15 INPUT
•
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
OPERATING TEMP RANGE+0.0 TO 70.0 CELSIUS DEGC
INCLOSURE CONFIGURATIONDUAL-IN-LINE
TERMINAL TYPE AND QUANTITY28 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.600 INCHES MAXIMUM IN
FEATURES PROVIDEDMONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE
INPUT CIRCUIT PATTERN15 INPUT
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
BIT QUANTITY65536
INCLOSURE MATERIALCERAMIC
VERIFIED SUBSTITUTES & CROSS-REFERENCES 12
120R0C36CLASS3Interchangeable
interchangeable cross-reference
interchangeable
SC1204-41Interchangeable
interchangeable cross-reference
interchangeable
D27642Interchangeable
interchangeable cross-reference
interchangeable
55660-90047Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 040Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is AM2764-2DC?
AM2764-2DC is a MICROCIRCUIT,MEMORY.
What parts can replace AM2764-2DC?
There are 12 known substitutes for AM2764-2DC: 120R0C36CLASS3, SC1204-41, D27642 and 9 more. Substitute compatibility should be verified for your specific system.
What is the NSN for AM2764-2DC?
AM2764-2DC is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-232-5450. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026