15-513934-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

15-513934-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.360 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN, body_height: 0.050 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND BIPOLAR AND W/ENABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: PROM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-227-8227, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

15-513934-1

NSN: 5962-01-227-8227
FSC: 5962 — Microcircuits, Electronic
CAGE: 04655 — GENERAL DYNAMICS MISSION SYSTEMS, INC. (USA)

SPECIFICATIONS

body_width	0.360 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN
body_height	0.050 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND BIPOLAR AND W/ENABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	24 FLAT LEADS
NSN	5962-01-227-8227

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.360 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.050 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN

•

CAPITANCE RATING PER CHARACTERISTIC: 10.00 INPUT PICOFARADS MAXIMUM AND 18.00 OUTPUT PICOFARADS MAXIMUM

•

FEATURES PROVIDED: MONOLITHIC AND BIPOLAR AND W/ENABLE

•

INCLOSURE CONFIGURATION: FLAT PACK

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.360 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN
BODY HEIGHT	0.050 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
CAPITANCE RATING PER CHARACTERISTIC	10.00 INPUT PICOFARADS MAXIMUM AND 18.00 OUTPUT PICOFARADS MAXIMUM
FEATURES PROVIDED	MONOLITHIC AND BIPOLAR AND W/ENABLE
INCLOSURE CONFIGURATION	FLAT PACK
CURRENT RATING PER CHARACTERISTIC	165.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPE	PROM

SUBSTITUTES & CROSS-REFERENCES 2

82S181/BKAReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM FAMILY 112Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 15-513934-1?

15-513934-1 is a MICROCIRCUIT,MEMORY.

What parts can replace 15-513934-1?

There are 2 known substitutes for 15-513934-1: 82S181/BKA, ROM/PROM FAMILY 112. Substitute compatibility should be verified for your specific system.

What is the NSN for 15-513934-1?

15-513934-1 is cataloged in the U.S. Government catalog under NSN 5962-01-227-8227. This indicates validated use in U.S. government and defense supply chains.

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