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Technical Data Sheet
PartsTable / COMPONENT / 10096520-T101
10096520-T101 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.210 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-232-6519, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
10096520-T101
NSN: 5962-01-232-6519
FSC: 5962
CAGE: 94580 — HONEYWELL INTERNATIONAL INC. DBA HONEYWELL INTERNATIONAL DIV AEROSPACE-MINNEAPOLIS (USA)
SPECIFICATIONS
body_width0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height0.210 INCHES MAXIMUM IN
body_length1.290 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE
output_logic_formMETAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 125.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 100.0 CELSIUS DEGC
input_circuit_pattern13 INPUT
inclosure_configurationDUAL-IN-LINE
NSN5962-01-232-6519
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 10096520-T101 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
•
TIME RATING PER CHACTERISTIC: 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
•
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
•
MEMORY DEVICE TYPE: ROM
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 6.0 VOLTS MAXIMUM POWER SOURCE
•
CASE OUTLINE SOURCE AND DESIGNATOR: D-3 MIL-M-38510
•
TERMINAL SURFACE TREATMENT: SOLDER
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
INCLOSURE CONFIGURATIONDUAL-IN-LINE
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MEMORY DEVICE TYPEROM
VOLTAGE RATING AND TYPE PER CHARACTERISTIC6.0 VOLTS MAXIMUM POWER SOURCE
CASE OUTLINE SOURCE AND DESIGNATORD-3 MIL-M-38510
TERMINAL SURFACE TREATMENTSOLDER
OPERATING TEMP RANGE-55.0 TO 100.0 CELSIUS DEGC
STORAGE TEMP RANGE-65.0 TO 125.0 CELSIUS DEGC
VERIFIED SUBSTITUTES & CROSS-REFERENCES 15
F2716DLQBInterchangeable
interchangeable cross-reference
interchangeable
MM2716QM/883BInterchangeable
interchangeable cross-reference
interchangeable
H990762-001BInterchangeable
interchangeable cross-reference
interchangeable
MD2716/BInterchangeable
interchangeable cross-reference
interchangeable
AM2716DMBInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 020Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 10096520-T101?
10096520-T101 is a MICROCIRCUIT,MEMORY.
What parts can replace 10096520-T101?
There are 15 known substitutes for 10096520-T101: F2716DLQB, MM2716QM/883B, H990762-001B and 12 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 10096520-T101?
10096520-T101 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-232-6519. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026