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TPC1280MGB176B — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

TPC1280MGB176B: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 2.515 INCHES MAXIMUM IN, body_height: 0.105 INCHES MAXIMUM IN, body_length: 2.515 INCHES MAXIMUM IN, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: PAL. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-412-2828, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
TPC1280MGB176B
NSN: 5962-01-412-2828
FSC: 5962 — Microcircuits, Electronic
CAGE: 01295 — TEXAS INSTRUMENTS INCORPORATED (USA)
SPECIFICATIONS
body_width2.515 INCHES MAXIMUM IN
body_height0.105 INCHES MAXIMUM IN
body_length2.515 INCHES MAXIMUM IN
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationPIN GRID ARRAY
terminal_surface_treatmentSOLDER
terminal_type_and_quantity176 PIN
time_rating_per_chacteristic251.00 NANOSECONDS MAXIMUM DELAY NS
NSN5962-01-412-2828
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN TPC1280MGB176B MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 2.515 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.105 INCHES MAXIMUM IN
•
INCLOSURE CONFIGURATION: PIN GRID ARRAY
•
CURRENT RATING PER CHARACTERISTIC: 25.00 MILLIAMPERES MAXIMUM SUPPLY
•
MEMORY DEVICE TYPE: PAL
•
BODY LENGTH: 2.515 INCHES MAXIMUM IN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH2.515 INCHES MAXIMUM IN
BODY HEIGHT0.105 INCHES MAXIMUM IN
INCLOSURE CONFIGURATIONPIN GRID ARRAY
CURRENT RATING PER CHARACTERISTIC25.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPEPAL
BODY LENGTH2.515 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
SUBSTITUTES & CROSS-REFERENCES 7
5962-9215601MXXReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-9215601MXASame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
351-4526-020Reference document
Same NSN cross-reference
Reference document — Secondary reference
5962-92156Reference document
Same NSN cross-reference
Reference document — Identification reference
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-9215601MXBReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is TPC1280MGB176B?
TPC1280MGB176B is a MICROCIRCUIT,MEMORY.
What parts can replace TPC1280MGB176B?
There are 7 known substitutes for TPC1280MGB176B: 5962-9215601MXX, 5962-9215601MXA, 351-4526-020 and 4 more. Substitute compatibility should be verified for your specific system.
What is the NSN for TPC1280MGB176B?
TPC1280MGB176B is cataloged in the U.S. Government catalog under NSN 5962-01-412-2828. This indicates validated use in U.S. government and defense supply chains.
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