351-4526-020: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 2.515 INCHES MAXIMUM IN, body_height: 0.105 INCHES MAXIMUM IN, body_length: 2.515 INCHES MAXIMUM IN, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: PAL. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-412-2828, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 2.515 INCHES MAXIMUM IN |
| body_height | 0.105 INCHES MAXIMUM IN |
| body_length | 2.515 INCHES MAXIMUM IN |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | PIN GRID ARRAY |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 176 PIN |
| time_rating_per_chacteristic | 251.00 NANOSECONDS MAXIMUM DELAY NS |
| NSN | 5962-01-412-2828 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 2.515 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.105 INCHES MAXIMUM IN |
| INCLOSURE CONFIGURATION | PIN GRID ARRAY |
| CURRENT RATING PER CHARACTERISTIC | 25.00 MILLIAMPERES MAXIMUM SUPPLY |
| MEMORY DEVICE TYPE | PAL |
| BODY LENGTH | 2.515 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |