The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, body_length: 0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND MEDIUM SPEED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-119-7549, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN |
| body_height | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN |
| body_length | 0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND MEDIUM SPEED |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | DUAL 2 INPUT |
| end_item_identification | MISSDATAPREPS FSCM 82918 |
| inclosure_configuration | DUAL-IN-LINE |
| NSN | 5962-01-119-7549 |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| BODY WIDTH | 0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| INPUT CIRCUIT PATTERN | DUAL 2 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| END ITEM IDENTIFICATION | MISSDATAPREPS FSCM 82918 |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND MEDIUM SPEED |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |