The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.180 INCHES NOMINAL IN, body_length: 0.400 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-187-9291, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.310 INCHES MAXIMUM IN |
| body_height | 0.180 INCHES NOMINAL IN |
| body_length | 0.400 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 4 INPUT |
| end_item_identification | F-18 ACFT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-187-9291 |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| INPUT CIRCUIT PATTERN | 4 INPUT |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN |
| BODY LENGTH | 0.400 INCHES MAXIMUM IN |
| CURRENT RATING PER CHARACTERISTIC | 76.00 MILLIAMPERES MAXIMUM SUPPLY |
| INCLOSURE MATERIAL | CERAMIC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| BODY WIDTH | 0.310 INCHES MAXIMUM IN |