The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.270 INCHES NOMINAL IN, body_height: 0.150 INCHES NOMINAL IN, body_length: 0.760 INCHES NOMINAL IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND W/STORAGE AND HIGH SPEED AND WIRE-OR OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-082-4389, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.270 INCHES NOMINAL IN |
| body_height | 0.150 INCHES NOMINAL IN |
| body_length | 0.760 INCHES NOMINAL IN |
| memory_capacity | UNKNOWN |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND W/STORAGE AND HIGH SPEED AND WIRE-OR OUTPUTS |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | +0.0 TO 75.0 CELSIUS DEGC |
| input_circuit_pattern | 6 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| NSN | 5962-01-082-4389 |
| BODY WIDTH | 0.270 INCHES NOMINAL IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND W/STORAGE AND HIGH SPEED AND WIRE-OR OUTPUTS |
| MEMORY CAPACITY | UNKNOWN |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| MEMORY DEVICE TYPE | ROM |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INPUT CIRCUIT PATTERN | 6 INPUT |
| INCLOSURE MATERIAL | CERAMIC |