10352000 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

10352000: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, body_length: 0.870 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: MONOLITHIC AND PROGRAMMABLE AND PROGRAMMED AND SCHOTTKY AND W/ENABLE AND POSITIVE OUTPUTS AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-037-6411, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

10352000

NSN: 5962-01-037-6411
FSC: 5962 — Microcircuits, Electronic
CAGE: 20227 — HENLEY MARINE, INC (USA)

SPECIFICATIONS

body_width	0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
body_height	0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
body_length	0.870 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	MONOLITHIC AND PROGRAMMABLE AND PROGRAMMED AND SCHOTTKY AND W/ENABLE AND POSITIVE OUTPUTS AND 3-STATE OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	6 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-037-6411

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 6 INPUT

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND PROGRAMMABLE AND PROGRAMMED AND SCHOTTKY AND W/ENABLE AND POSITIVE OUTPUTS AND 3-STATE OUTPUT

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	6 INPUT
INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
BODY HEIGHT	0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND PROGRAMMABLE AND PROGRAMMED AND SCHOTTKY AND W/ENABLE AND POSITIVE OUTPUTS AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.870 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 4

ED1320-001Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

10352000-AReference document

Same NSN cross-reference

Reference document — Secondary reference

SN74S288NReference document

Same NSN cross-reference

Reference document — Secondary reference

TBP18S030NReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 10352000?

10352000 is a MICROCIRCUIT,MEMORY.

What parts can replace 10352000?

There are 4 known substitutes for 10352000: ED1320-001, 10352000-A, SN74S288N and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 10352000?

10352000 is cataloged in the U.S. Government catalog under NSN 5962-01-037-6411. This indicates validated use in U.S. government and defense supply chains.

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