SMJ5517-15JD — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

SMJ5517-15JD: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.560 INCHES NOMINAL IN, body_height: 0.120 INCHES MAXIMUM IN, body_length: 1.200 INCHES NOMINAL IN, features_provided: BURN IN AND MONOLITHIC AND STATIC OPERATION, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-229-3339, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

SMJ5517-15JD

NSN: 5962-01-229-3339
FSC: 5962 — Microcircuits, Electronic
CAGE: 01295 — TEXAS INSTRUMENTS INCORPORATED (USA)

SPECIFICATIONS

body_width	0.560 INCHES NOMINAL IN
body_height	0.120 INCHES MAXIMUM IN
body_length	1.200 INCHES NOMINAL IN
features_provided	BURN IN AND MONOLITHIC AND STATIC OPERATION
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	19 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-229-3339

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 19 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.560 INCHES NOMINAL IN

•

BODY HEIGHT: 0.120 INCHES MAXIMUM IN

•

FEATURES PROVIDED: BURN IN AND MONOLITHIC AND STATIC OPERATION

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	19 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.560 INCHES NOMINAL IN
BODY HEIGHT	0.120 INCHES MAXIMUM IN
FEATURES PROVIDED	BURN IN AND MONOLITHIC AND STATIC OPERATION
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.200 INCHES NOMINAL IN
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC

SUBSTITUTES & CROSS-REFERENCES 2

IDT6116S150DBReference document

Same NSN cross-reference

Reference document — Secondary reference

IDT6116SA150DReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is SMJ5517-15JD?

SMJ5517-15JD is a MICROCIRCUIT,MEMORY.

What parts can replace SMJ5517-15JD?

There are 2 known substitutes for SMJ5517-15JD: IDT6116S150DB, IDT6116SA150D. Substitute compatibility should be verified for your specific system.

What is the NSN for SMJ5517-15JD?

SMJ5517-15JD is cataloged in the U.S. Government catalog under NSN 5962-01-229-3339. This indicates validated use in U.S. government and defense supply chains.

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