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Technical Data Sheet

S8T97F/883B — MICROCIRCUIT,DIGITAL

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

S8T97F/883B: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.280 INCHES MAXIMUM IN, body_height: 0.180 INCHES NOMINAL IN, body_length: 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, features_provided: 3-STATE OUTPUT AND HIGH SPEED AND ELECTROSTATIC SENSITIVE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC OR METAL. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-027-1743, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
S8T97F/883B
NSN: 5962-01-027-1743
NIINs: 010271743, 011143303, 012294028
FSC: 5962 — Microcircuits, Electronic
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)
SPECIFICATIONS
body_width0.280 INCHES MAXIMUM IN
body_height0.180 INCHES NOMINAL IN
body_length0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
features_provided3-STATE OUTPUT AND HIGH SPEED AND ELECTROSTATIC SENSITIVE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC OR METAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern8 INPUT
end_item_identificationSIGNAL PROCESSOR FSCM 15786
inclosure_configurationDUAL-IN-LINE
NSN5962-01-027-1743
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN S8T97F/883B MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
•
INPUT CIRCUIT PATTERN: HEX 1 INPUT
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
TERMINAL SURFACE TREATMENT: SOLDER
•
DESIGN FUNCTION AND QUANTITY: 6 BUFFER, INVERTING
•
BODY WIDTH: 0.240 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND HIGH SPEED AND SCHOTTKY AND W/DISABLE AND 3-STATE OUTPUT
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERNHEX 1 INPUT
INCLOSURE MATERIALCERAMIC AND GLASS
TERMINAL SURFACE TREATMENTSOLDER
DESIGN FUNCTION AND QUANTITY6 BUFFER, INVERTING
BODY WIDTH0.240 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
BODY HEIGHT0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND MONOLITHIC AND HIGH SPEED AND SCHOTTKY AND W/DISABLE AND 3-STATE OUTPUT
INCLOSURE CONFIGURATIONDUAL-IN-LINE
CASE OUTLINE SOURCE AND DESIGNATORT0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL
BODY LENGTH0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
SUBSTITUTES & CROSS-REFERENCES 9
8T97NReference document
Same NSN cross-reference
Reference document — Secondary reference
308860-2Reference document
Same NSN cross-reference
Reference document — Secondary reference
S8T97F/883CReference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
51NW9615B71Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
30470044Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
8000-08-9700Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Demilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is S8T97F/883B?
S8T97F/883B is a MICROCIRCUIT,DIGITAL.
What parts can replace S8T97F/883B?
There are 9 known substitutes for S8T97F/883B: 8T97N, 308860-2, S8T97F/883C and 6 more. Substitute compatibility should be verified for your specific system.
What is the NSN for S8T97F/883B?
S8T97F/883B is cataloged in the U.S. Government catalog under NSN 5962-01-027-1743. This indicates validated use in U.S. government and defense supply chains.
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