308860-2 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

308860-2: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, body_length: 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND HIGH SPEED AND SCHOTTKY AND W/DISABLE AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-027-1743, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

308860-2

NSN: 5962-01-027-1743
FSC: 5962 — Microcircuits, Electronic
CAGE: 15280 — NORTHROP GRUMMAN SYSTEMS CORPORATION DIV ES DEFENSIVE SYSTEMS DIVISION (USA)

SPECIFICATIONS

body_width	0.240 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
body_height	0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
body_length	0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND HIGH SPEED AND SCHOTTKY AND W/DISABLE AND 3-STATE OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	HEX 1 INPUT
end_item_identification	SIGNAL PROCESSOR FSCM 15786
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-027-1743

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: HEX 1 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 6 BUFFER, INVERTING

•

BODY WIDTH: 0.240 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND HIGH SPEED AND SCHOTTKY AND W/DISABLE AND 3-STATE OUTPUT

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	HEX 1 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	6 BUFFER, INVERTING
BODY WIDTH	0.240 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
BODY HEIGHT	0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND HIGH SPEED AND SCHOTTKY AND W/DISABLE AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CASE OUTLINE SOURCE AND DESIGNATOR	T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL
BODY LENGTH	0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 9

8T97NReference document

Same NSN cross-reference

Reference document — Secondary reference

S8T97F/883BReference document

Same NSN cross-reference

Reference document — Secondary reference

S8T97F/883CReference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

51NW9615B71Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

30470044Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

8000-08-9700Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 308860-2?

308860-2 is a MICROCIRCUIT,DIGITAL.

What parts can replace 308860-2?

There are 9 known substitutes for 308860-2: 8T97N, S8T97F/883B, S8T97F/883C and 6 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 308860-2?

308860-2 is cataloged in the U.S. Government catalog under NSN 5962-01-027-1743. This indicates validated use in U.S. government and defense supply chains.

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