The SEMICONDUCTOR DEVICE,THYRISTOR is a the manufacturer industrial component. Key specifications include overall_length: 0.160 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, overall_diameter: 0.305 INCHES MINIMUM AND 0.335 INCHES MAXIMUM IN, special_features: JUNCTION PATTERN ARRANGEMENT: PNPN, features_provided: HERMETICALLY SEALED CASE, internal_configuration: JUNCTION CONTACT, semiconductor_material: SILICON. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-01-023-9967, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_length | 0.160 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| overall_diameter | 0.305 INCHES MINIMUM AND 0.335 INCHES MAXIMUM IN |
| special_features | JUNCTION PATTERN ARRANGEMENT: PNPN |
| features_provided | HERMETICALLY SEALED CASE |
| internal_configuration | JUNCTION CONTACT |
| semiconductor_material | SILICON |
| terminal_type_and_quantity | 3 UNINSULATED WIRE LEAD |
| NSN | 5961-01-023-9967 |
| SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: PNPN |
| TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |
| OVERALL LENGTH | 0.160 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| INTERNAL CONFIGURATION | JUNCTION CONTACT |
| SEMICONDUCTOR MATERIAL | SILICON |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| OVERALL DIAMETER | 0.305 INCHES MINIMUM AND 0.335 INCHES MAXIMUM IN |