Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: RY1044-1001

RY1044-1001 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.275 INCHES NOMINAL IN, body_height: 0.065 INCHES NOMINAL IN, body_length: 0.400 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: BURN IN AND BIPOLAR AND W/OPEN COLLECTOR AND MONOLITHIC AND PROGRAMMED AND W/ENABLE AND POSITIVE OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-127-8854, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

RY1044-1001

NSN: 5962-01-127-8854
FSC: 5962
CAGE: 07933 — FAIRCHILD SEMICONDUCTOR CORP SEMICONDUCTOR DIV HQ (USA)

SPECIFICATIONS

body_width	0.275 INCHES NOMINAL IN
body_height	0.065 INCHES NOMINAL IN
body_length	0.400 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	BURN IN AND BIPOLAR AND W/OPEN COLLECTOR AND MONOLITHIC AND PROGRAMMED AND W/ENABLE AND POSITIVE OUTPUTS
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
end_item_identification	F16AIRCOMBFIT 81755
NSN	5962-01-127-8854

COMPONENT DIAGRAM

KEY FEATURES

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INPUT CIRCUIT PATTERN: 10 INPUT

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OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

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BODY WIDTH: 0.275 INCHES NOMINAL IN

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MEMORY DEVICE TYPE: ROM

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS MAXIMUM POWER SOURCE

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TEST DATA DOCUMENT: 88818-A574A025 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)

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TERMINAL TYPE AND QUANTITY: 16 FLAT LEADS

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TERMINAL SURFACE TREATMENT: SOLDER

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

INPUT CIRCUIT PATTERN	10 INPUT
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
BODY WIDTH	0.275 INCHES NOMINAL IN
MEMORY DEVICE TYPE	ROM
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.5 VOLTS MAXIMUM POWER SOURCE
TEST DATA DOCUMENT	88818-A574A025 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)
TERMINAL TYPE AND QUANTITY	16 FLAT LEADS
TERMINAL SURFACE TREATMENT	SOLDER
MEMORY CAPACITY	UNKNOWN
END ITEM IDENTIFICATION	F16AIRCOMBFIT 81755

VERIFIED SUBSTITUTES & CROSS-REFERENCES 20

3485Interchangeable