ROM/PROM HEAD 188 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

ROM/PROM HEAD 188: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.325 INCHES MAXIMUM IN, body_height: 0.276 INCHES MAXIMUM IN, body_length: 1.000 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND TESTED TO MIL-STD-883 AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-368-0093, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

ROM/PROM HEAD 188

NSN: 5962-01-368-0093
FSC: 5962 — Microcircuits, Electronic
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)

SPECIFICATIONS

body_width	0.325 INCHES MAXIMUM IN
body_height	0.276 INCHES MAXIMUM IN
body_length	1.000 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND TESTED TO MIL-STD-883 AND MONOLITHIC
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	11 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-368-0093

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 11 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.325 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.276 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND TESTED TO MIL-STD-883 AND MONOLITHIC

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	11 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.325 INCHES MAXIMUM IN
BODY HEIGHT	0.276 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND TESTED TO MIL-STD-883 AND MONOLITHIC
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PROM
BODY LENGTH	1.000 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

29653ADM/883BSame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

R29653ADM/883BReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is ROM/PROM HEAD 188?

ROM/PROM HEAD 188 is a MICROCIRCUIT,MEMORY.

What parts can replace ROM/PROM HEAD 188?

There are 2 known substitutes for ROM/PROM HEAD 188: 29653ADM/883B, R29653ADM/883B. Substitute compatibility should be verified for your specific system.

What is the NSN for ROM/PROM HEAD 188?

ROM/PROM HEAD 188 is cataloged in the U.S. Government catalog under NSN 5962-01-368-0093. This indicates validated use in U.S. government and defense supply chains.

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