R29653ADM/883B: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.325 INCHES MAXIMUM IN, body_height: 0.276 INCHES MAXIMUM IN, body_length: 1.000 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND TESTED TO MIL-STD-883 AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-263-4011, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.325 INCHES MAXIMUM IN |
| body_height | 0.276 INCHES MAXIMUM IN |
| body_length | 1.000 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND TESTED TO MIL-STD-883 AND MONOLITHIC |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 11 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| NSN | 5962-01-263-4011 |
| INCLOSURE MATERIAL | CERAMIC OR METAL OR GLASS OR PLASTIC |
| FEATURES PROVIDED | PROGRAMMABLE AND MONOLITHIC |
| MEMORY DEVICE TYPE | ROM |