ROM/PROM HEAD 155 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

ROM/PROM HEAD 155: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN, body_length: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND PROGRAMMABLE AND BURN IN AND ULTRAVIOLET ERASABLE AND W/ENABLE, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-285-3500, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

ROM/PROM HEAD 155

NSN: 5962-01-285-3500
FSC: 5962 — Microcircuits, Electronic
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)

SPECIFICATIONS

body_width	0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN
body_height	0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
body_length	0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND PROGRAMMABLE AND BURN IN AND ULTRAVIOLET ERASABLE AND W/ENABLE
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
inclosure_configuration	LEADLESS FLAT PACK
NSN	5962-01-285-3500

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 16 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND PROGRAMMABLE AND BURN IN AND ULTRAVIOLET ERASABLE AND W/ENABLE

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES MAXIMUM SUPPLY

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	16 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN
BODY HEIGHT	0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND PROGRAMMABLE AND BURN IN AND ULTRAVIOLET ERASABLE AND W/ENABLE
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
CURRENT RATING PER CHARACTERISTIC	100.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPE	PROM
CASE OUTLINE SOURCE AND DESIGNATOR	C-12 MIL-M-38510

SUBSTITUTES & CROSS-REFERENCES 7

82005Reference document

Same NSN cross-reference

Reference document — Identification reference

807668-8Reference document

Same NSN cross-reference

Reference document — Secondary reference

8200504ZXReference document

Same NSN cross-reference

Reference document — Secondary reference

8200504ZASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

8200504ZBReference document

Same NSN cross-reference

Reference document — Secondary reference

MR2764A-25/BReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is ROM/PROM HEAD 155?

ROM/PROM HEAD 155 is a MICROCIRCUIT,MEMORY.

What parts can replace ROM/PROM HEAD 155?

There are 7 known substitutes for ROM/PROM HEAD 155: 82005, 807668-8, 8200504ZX and 4 more. Substitute compatibility should be verified for your specific system.

What is the NSN for ROM/PROM HEAD 155?

ROM/PROM HEAD 155 is cataloged in the U.S. Government catalog under NSN 5962-01-285-3500. This indicates validated use in U.S. government and defense supply chains.

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