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Technical Data Sheet

MR2764A-25/B — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

MR2764A-25/B: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.458 INCHES MAXIMUM IN, body_height: 0.120 INCHES MAXIMUM IN, body_length: 0.560 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE AND ELECTROSTATIC SENSITIVE, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-274-7052, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
MR2764A-25/B
NSN: 5962-01-274-7052
NIINs: 012747052, 012853500
FSC: 5962 — Microcircuits, Electronic
CAGE: 3V146 — ROCHESTER ELECTRONICS LLC (USA)
SPECIFICATIONS
body_width0.458 INCHES MAXIMUM IN
body_height0.120 INCHES MAXIMUM IN
body_length0.560 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE AND ELECTROSTATIC SENSITIVE
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 125.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern16 INPUT
end_item_identificationF/A-18 HORNET AIRCRAFT
NSN5962-01-274-7052
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN MR2764A-25/B MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 16 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.458 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.120 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE AND ELECTROSTATIC SENSITIVE
•
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN16 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.458 INCHES MAXIMUM IN
BODY HEIGHT0.120 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
MEMORY DEVICE TYPEROM
BODY LENGTH0.560 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 125.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 2
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
AM2764A-25BUCReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is MR2764A-25/B?
MR2764A-25/B is a MICROCIRCUIT,MEMORY.
What parts can replace MR2764A-25/B?
There are 2 known substitutes for MR2764A-25/B: ROM/PROM, AM2764A-25BUC. Substitute compatibility should be verified for your specific system.
What is the NSN for MR2764A-25/B?
MR2764A-25/B is cataloged in the U.S. Government catalog under NSN 5962-01-274-7052. This indicates validated use in U.S. government and defense supply chains.
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