Name: ROM/PROM HEAD 105
Brand: Unknown
SKU: ROM/PROM HEAD 105

ROM/PROM HEAD 105 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The ROM/PROM HEAD 105 is a the manufacturer industrial component. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-248-8654, indicating validated use in U.S. government and defense logistics supply chains.

Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

ROM/PROM HEAD 105

NSN: 5962-01-248-8654
FSC: 5962
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)

SPECIFICATIONS

Part Number	ROM/PROM HEAD 105
NSN	5962-01-248-8654

COMPONENT DIAGRAM

KEY FEATURES

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OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR

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TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

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FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC

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BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

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STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

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CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES MAXIMUM OUTPUT SINK

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MEMORY DEVICE TYPE: PAL

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MAXIMUM POWER DISSIPATION RATING: 2.0 WATTS

TECHNICAL CHARACTERISTICS (FLIS)

OUTPUT LOGIC FORM	BIPOLAR METAL-OXIDE SEMICONDUCTOR
TIME RATING PER CHACTERISTIC	45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC
BODY WIDTH	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
CURRENT RATING PER CHARACTERISTIC	100.00 MILLIAMPERES MAXIMUM OUTPUT SINK
MEMORY DEVICE TYPE	PAL
MAXIMUM POWER DISSIPATION RATING	2.0 WATTS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.0 VOLTS NOMINAL POWER SOURCE
TERMINAL SURFACE TREATMENT	SOLDER

VERIFIED SUBSTITUTES & CROSS-REFERENCES 28

5962-3850309BRXInterchangeable