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Technical Data Sheet
PartsTable / COMPONENT / 5962-3850309BRX
5962-3850309BRX ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMABLE AND BIPOLAR, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-174-1380, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5962-3850309BRX
NSN: 5962-01-174-1380
FSC: 5962
CAGE: 81349 — MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length1.060 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMABLE AND BIPOLAR
output_logic_formBIPOLAR METAL-OXIDE SEMICONDUCTOR
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern16 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-174-1380
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5962-3850309BRX MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
BODY HEIGHT: 0.185 INCHES MAXIMUM IN
•
SPECIFICATION/STANDARD DATA: 81349-MIL-M-38510/503 GOVERNMENT SPECIFICATION
•
CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES MAXIMUM OUTPUT SINK
•
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
•
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMABLE AND BIPOLAR
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY LENGTH: 1.060 INCHES MAXIMUM IN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
BODY HEIGHT0.185 INCHES MAXIMUM IN
SPECIFICATION/STANDARD DATA81349-MIL-M-38510/503 GOVERNMENT SPECIFICATION
CURRENT RATING PER CHARACTERISTIC100.00 MILLIAMPERES MAXIMUM OUTPUT SINK
OUTPUT LOGIC FORMBIPOLAR METAL-OXIDE SEMICONDUCTOR
TIME RATING PER CHACTERISTIC45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMABLE AND BIPOLAR
TERMINAL SURFACE TREATMENTSOLDER
BODY LENGTH1.060 INCHES MAXIMUM IN
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEPAL
VERIFIED SUBSTITUTES & CROSS-REFERENCES 26
7909914-12Interchangeable
interchangeable cross-reference
interchangeable
PAL12L6Interchangeable
interchangeable cross-reference
interchangeable
DMPAL12L6J/883Interchangeable
interchangeable cross-reference
interchangeable
PAL10L8Interchangeable
interchangeable cross-reference
interchangeable
FR551-1210-082NInterchangeable
interchangeable cross-reference
interchangeable
5962-3850306BRBInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 5962-3850309BRX?
5962-3850309BRX is a MICROCIRCUIT,MEMORY.
What parts can replace 5962-3850309BRX?
There are 26 known substitutes for 5962-3850309BRX: 7909914-12, PAL12L6, DMPAL12L6J/883 and 23 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 5962-3850309BRX?
5962-3850309BRX is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-174-1380. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026