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Technical Data Sheet

ROM/PROM FAMILY 273 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

ROM/PROM FAMILY 273: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include special_features: ITEM SHALL BE PROGRAMMED IN ACCORDANCE WITH SMD 5962-8984102KX, features_provided: PROGRAMMED, memory_device_type: ROM, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, test_data_document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)., operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-413-7275, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
ROM/PROM FAMILY 273
NSN: 5962-01-413-7275
NIINs: 014137275, 014767249, 014767251
FSC: 5962 — Microcircuits, Electronic
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)
SPECIFICATIONS
special_featuresITEM SHALL BE PROGRAMMED IN ACCORDANCE WITH SMD 5962-8984102KX
features_providedPROGRAMMED
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationFLAT PACK
terminal_type_and_quantity24 FLAT LEADS
part_name_assigned_by_controlling_agencyMICROCIRCUIT, DIGITAL-CMOS MEMORY, ELECTRICALLY ERASABLE PROGRAMMED ARRAY LOGIC, MONOLITHIC SILICON
voltage_rating_and_type_per_characteristic-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
NSN5962-01-413-7275
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN ROM/PROM FAMILY 273 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
FEATURES PROVIDED: PROGRAMMED
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
FEATURES PROVIDEDPROGRAMMED
MEMORY DEVICE TYPEROM
SUBSTITUTES & CROSS-REFERENCES 5
SH8000249-003Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
H8000249-003Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
5962-8984102KAReference document
Same NSN cross-reference
Reference document — Secondary reference
H8000249-002FReference document
Same NSN cross-reference
Reference document — Secondary reference
H8000249-003FReference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is ROM/PROM FAMILY 273?
ROM/PROM FAMILY 273 is a MICROCIRCUIT,MEMORY.
What parts can replace ROM/PROM FAMILY 273?
There are 5 known substitutes for ROM/PROM FAMILY 273: SH8000249-003, H8000249-003, 5962-8984102KA and 2 more. Substitute compatibility should be verified for your specific system.
What is the NSN for ROM/PROM FAMILY 273?
ROM/PROM FAMILY 273 is cataloged in the U.S. Government catalog under NSN 5962-01-413-7275. This indicates validated use in U.S. government and defense supply chains.
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