5962-8984102KA: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include special_features: GENERIC P/N 22V10/22-INPUT, 10 OUYPUT, EECMOS, ARCHITECTURALLY GENERIC, PROGRAMMABLE AND-OR ARRAY, features_provided: ERASABLE AND PROGRAMMABLE AND LOW POWER AND HIGH RELIABILITY AND MONOLITHIC, inclosure_material: GLASS AND CERAMIC, memory_device_type: PAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, test_data_document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-413-7275, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| special_features | GENERIC P/N 22V10/22-INPUT, 10 OUYPUT, EECMOS, ARCHITECTURALLY GENERIC, PROGRAMMABLE AND-OR ARRAY |
| features_provided | ERASABLE AND PROGRAMMABLE AND LOW POWER AND HIGH RELIABILITY AND MONOLITHIC |
| inclosure_material | GLASS AND CERAMIC |
| memory_device_type | PAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | FLAT PACK |
| terminal_type_and_quantity | 24 BONDING PAD |
| time_rating_per_chacteristic | 20.00 NANOSECONDS NOMINAL ACCESS NS |
| maximum_power_dissipation_rating | 1.5 WATTS |
| part_name_assigned_by_controlling_agency | MICROCIRCUIT, MEMORY, DIGITAL, CMOS, PROGRAMMABLE ARRAY LOGIC (EEPLD), MONOLITHIC SILICON |
| NSN | 5962-01-413-7275 |
| FEATURES PROVIDED | PROGRAMMED |
| MEMORY DEVICE TYPE | ROM |