619126-28 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

619126-28: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.260 INCHES MAXIMUM IN, body_height: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN, body_length: 0.260 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC, output_logic_form: CURRENT-MODE LOGIC, precious_material: GOLD. This part is cataloged in the U.S.

Government catalog under NSN 5962-00-001-1905, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

619126-28

NSN: 5962-00-001-1905
FSC: 5962 — Microcircuits, Electronic
CAGE: 37695 — RAYTHEON COMPANY (USA)

SPECIFICATIONS

body_width	0.260 INCHES MAXIMUM IN
body_height	0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
body_length	0.260 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND MONOLITHIC
output_logic_form	CURRENT-MODE LOGIC
precious_material	GOLD
inclosure_material	CERAMIC AND GLASS
memory_device_type	DIODE MATRIX
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	6 INPUT
inclosure_configuration	FLAT PACK
NSN	5962-00-001-1905

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 6 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: GOLD

•

PRECIOUS MATERIAL: GOLD

•

BODY WIDTH: 0.260 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC

•

INCLOSURE CONFIGURATION: FLAT PACK

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	6 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	GOLD
PRECIOUS MATERIAL	GOLD
BODY WIDTH	0.260 INCHES MAXIMUM IN
BODY HEIGHT	0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	DIODE MATRIX
BODY LENGTH	0.260 INCHES MAXIMUM IN

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909 5962-00-001-1910

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROM FAMILY 057Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is 619126-28?

619126-28 is a MICROCIRCUIT,MEMORY.

What parts can replace 619126-28?

There is 1 known substitute for 619126-28: ROM/PROM FAMILY 057. Substitute compatibility should be verified for your specific system.

What is the NSN for 619126-28?

619126-28 is cataloged in the U.S. Government catalog under NSN 5962-00-001-1905. This indicates validated use in U.S. government and defense supply chains.

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