PALC16L8-20WMB — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

PALC16L8-20WMB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: PROGRAMMED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, memory_device_type: PAL. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-316-9107, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

PALC16L8-20WMB

NSN: 5962-01-316-9107
NIINs: 013169107, 014481706, 014481805
FSC: 5962 — Microcircuits, Electronic
CAGE: 65786 — INFINEON TECHNOLOGIES AMERICAS CORP. (USA)

SPECIFICATIONS

body_width	0.310 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	1.060 INCHES MAXIMUM IN
features_provided	PROGRAMMED
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
memory_device_type	PAL
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
end_item_identification	P/N 736723, FSCM 18323
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
time_rating_per_chacteristic	20.00 NANOSECONDS MAXIMUM INPUT TO OUTPUT ACCESS NS
maximum_power_dissipation_rating	1.0 WATTS
NSN	5962-01-316-9107

COMPONENT DIAGRAM

KEY FEATURES

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: PROGRAMMABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

CURRENT RATING PER CHARACTERISTIC: 24.00 MILLIAMPERES MAXIMUM OUTPUT SINK

•

MEMORY DEVICE TYPE: PAL

•

BODY LENGTH: 1.060 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	PROGRAMMABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC	24.00 MILLIAMPERES MAXIMUM OUTPUT SINK
MEMORY DEVICE TYPE	PAL
BODY LENGTH	1.060 INCHES MAXIMUM IN
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.0 VOLTS NOMINAL POWER SOURCE

SUBSTITUTES & CROSS-REFERENCES 5

5962-88678Reference document

Same NSN cross-reference

Reference document — Identification reference

5962-8867809RBReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8867809RASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

5962-8867809RXReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM HEAD 192Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is PALC16L8-20WMB?

PALC16L8-20WMB is a MICROCIRCUIT,MEMORY.

What parts can replace PALC16L8-20WMB?

There are 5 known substitutes for PALC16L8-20WMB: 5962-88678, 5962-8867809RB, 5962-8867809RA and 2 more. Substitute compatibility should be verified for your specific system.

What is the NSN for PALC16L8-20WMB?

PALC16L8-20WMB is cataloged in the U.S. Government catalog under NSN 5962-01-316-9107. This indicates validated use in U.S. government and defense supply chains.

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