5962-8867809RA: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: PROGRAMMED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, memory_device_type: PAL. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-316-9107, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.310 INCHES MAXIMUM IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 1.060 INCHES MAXIMUM IN |
| features_provided | PROGRAMMED |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| memory_device_type | PAL |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| end_item_identification | INTERFACE, MAI / CIRCUIT CARD ASSEMBLY,BMT-HTS |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| time_rating_per_chacteristic | 20.00 NANOSECONDS MAXIMUM INPUT TO OUTPUT ACCESS NS |
| maximum_power_dissipation_rating | 1.0 WATTS |
| NSN | 5962-01-316-9107 |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.310 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.185 INCHES MAXIMUM IN |
| FEATURES PROVIDED | PROGRAMMABLE |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CURRENT RATING PER CHARACTERISTIC | 24.00 MILLIAMPERES MAXIMUM OUTPUT SINK |
| MEMORY DEVICE TYPE | PAL |
| BODY LENGTH | 1.060 INCHES MAXIMUM IN |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |