PAL16R8B-4MJ/883B — Technical Data Sheet

✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: BURN IN AND BIPOLAR AND MONOLITHIC AND PROGRAMMED, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-341-5894, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

PAL16R8B-4MJ/883B

NSN: 5962-01-341-5894
FSC: 5962
CAGE: 50364 — MMI/AMD (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	1.060 INCHES MAXIMUM IN
features_provided	BURN IN AND BIPOLAR AND MONOLITHIC AND PROGRAMMED
output_logic_form	BIPOLAR METAL-OXIDE SEMICONDUCTOR
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-341-5894

COMPONENT DIAGRAM

KEY FEATURES

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

•

MEMORY DEVICE TYPE: PROGRAMMED

•

OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

•

INCLOSURE MATERIAL: CERAMIC

•

OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: BURN IN AND PROGRAMMED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
MEMORY DEVICE TYPE	PROGRAMMED
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
INCLOSURE MATERIAL	CERAMIC
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	BURN IN AND PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
PART NAME ASSIGNED BY CONTROLLING AGENCY	MICROCIRCUIT,DIGITAL,PROGRAMMABLE LOGIC ARRAY

VERIFIED SUBSTITUTES & CROSS-REFERENCES 9

5962-88515Interchangeable