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Technical Data Sheet

210713-002 — Technical Data Sheet

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— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: BURN IN AND PROGRAMMED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: PROGRAMMED, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5895-01-505-7078, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
210713-002
NSN: 5895-01-505-7078
FSC: 5895
CAGE: 9X870 — DELFIN SYSTEMS DBA TITAN SYSTEMS CORPORATION (USA)
SPECIFICATIONS
features_providedBURN IN AND PROGRAMMED
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePROGRAMMED
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
part_name_assigned_by_controlling_agencyMICROCIRCUIT,DIGITAL,PROGRAMMABLE LOGIC ARRAY
NSN5895-01-505-7078
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 210713-002 MFR MICROCIRCUIT,MEMORY
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
END ITEM IDENTIFICATIONAN/MLQ40(V)3
SPECIAL FEATURESPROCESSOR SYSTEM INTERFACE
END ITEM IDENTIFICATIONAN/MLQ40(V)3
SPECIAL FEATURESPROCESSOR SYSTEM INTERFACE
VERIFIED SUBSTITUTES & CROSS-REFERENCES 14
G300266S1Same_fsc
same_fsc cross-reference
same_fsc
PDT30-55-11978Same_fsc
same_fsc cross-reference
same_fsc
1128SCAV824-1Same_fsc
same_fsc cross-reference
same_fsc
DS585-1Same_fsc
same_fsc cross-reference
same_fsc
398343-1Same_fsc
same_fsc cross-reference
same_fsc
616R352G01Same_fsc
same_fsc cross-reference
same_fsc
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMATSourcing: other
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FREQUENTLY ASKED QUESTIONS
What is 210713-002?
210713-002 is a MICROCIRCUIT,MEMORY.
What parts can replace 210713-002?
There are 14 known substitutes for 210713-002: G300266S1, PDT30-55-11978, 1128SCAV824-1 and 11 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 210713-002?
210713-002 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5895-01-505-7078. This indicates validated use in U.S. government and defense supply chains.
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