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Technical Data Sheet

PAL16R8-4MJ883B — Technical Data Sheet

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WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: PROGRAMMED, inclosure_material: CERAMIC, memory_device_type: PAL, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: DUAL-IN-LINE, terminal_surface_treatment: SOLDER. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System under NSN 5962-01-388-0428, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
PAL16R8-4MJ883B
NSN: 5962-01-388-0428
FSC: 5962
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)
SPECIFICATIONS
features_providedPROGRAMMED
inclosure_materialCERAMIC
memory_device_typePAL
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
voltage_rating_and_type_per_characteristic12.0 VOLTS MAXIMUM POWER SOURCE
NSN5962-01-388-0428
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN PAL16R8-4MJ883B MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
FEATURES PROVIDED: PROGRAMMED
•
TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 12.0 VOLTS MAXIMUM POWER SOURCE
•
INCLOSURE MATERIAL: CERAMIC
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: PAL
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
TERMINAL SURFACE TREATMENT: SOLDER
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
FEATURES PROVIDEDPROGRAMMED
TERMINAL TYPE AND QUANTITY20 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC12.0 VOLTS MAXIMUM POWER SOURCE
INCLOSURE MATERIALCERAMIC
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEPAL
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
TERMINAL SURFACE TREATMENTSOLDER
VERIFIED SUBSTITUTES & CROSS-REFERENCES 10
5857394-4InterchangeableGOVERNMENT REGISTRY
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 094InterchangeableGOVERNMENT REGISTRY
interchangeable cross-reference
interchangeable
PAL16R8-4InterchangeableGOVERNMENT REGISTRY
interchangeable cross-reference
interchangeable
5857507InterchangeableGOVERNMENT REGISTRY
interchangeable cross-reference
interchangeable
718-0642-001InterchangeableGOVERNMENT REGISTRY
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 189InterchangeableGOVERNMENT REGISTRY
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVEGOVERNMENT REGISTRY
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is PAL16R8-4MJ883B?
PAL16R8-4MJ883B is a MICROCIRCUIT,MEMORY.
What parts can replace PAL16R8-4MJ883B?
There are 10 known substitutes for PAL16R8-4MJ883B: 5857394-4, ROM/PROM FAMILY 094, PAL16R8-4 and 7 more. Substitute compatibility should be verified for your specific system.
What is the NSN for PAL16R8-4MJ883B?
PAL16R8-4MJ883B is cataloged in the Federal Logistics Information System under NSN 5962-01-388-0428. This indicates validated use in U.S. government and defense supply chains.
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