The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: PROGRAMMED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-370-0392, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 1.060 INCHES MAXIMUM IN |
| features_provided | PROGRAMMED |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 16 INPUT |
| hybrid_technology_type | MONOLITHIC |
| end_item_identification | FLEET DATA RE E/I FSCM 05869 |
| NSN | 5962-01-370-0392 |
| INCLOSURE MATERIAL | CERAMIC |
| INPUT CIRCUIT PATTERN | 16 INPUT |
| TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
| HYBRID TECHNOLOGY TYPE | MONOLITHIC |
| NONDEFINITIVE SPEC/STD DATA | 02 TYPE AND R CASE AND A FINISH AND 204 NUMBER |
| SPECIFICATION/STANDARD DATA | 67268-85065 GOVERNMENT STANDARD AND 56232-1219256 MANUFACTURERS SPECIFICATION CONTROL |
| MEMORY DEVICE TYPE | PAL |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES MAXIMUM OUTPUT SINK |