PAL16R68-2ML883B — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

PAL16R68-2ML883B: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.350 INCHES MAXIMUM IN, body_length: 0.350 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND BIPOLAR AND PROGRAMMABLE, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, precious_material: GOLD, inclosure_material: METAL OR PLASTIC OR CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-262-2721, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

PAL16R68-2ML883B

NSN: 5962-01-262-2721
FSC: 5962 — Microcircuits, Electronic
CAGE: 50364 — MMI/AMD (USA)

SPECIFICATIONS

body_width	0.350 INCHES MAXIMUM IN
body_length	0.350 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
output_logic_form	BIPOLAR METAL-OXIDE SEMICONDUCTOR
precious_material	GOLD
inclosure_material	METAL OR PLASTIC OR CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
inclosure_configuration	LEADED CHIP CARRIER
NSN	5962-01-262-2721

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 16 INPUT

•

INCLOSURE MATERIAL: METAL OR PLASTIC OR CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

PRECIOUS MATERIAL: GOLD

•

BODY WIDTH: 0.350 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND BIPOLAR AND PROGRAMMABLE

•

INCLOSURE CONFIGURATION: LEADED CHIP CARRIER

•

CURRENT RATING PER CHARACTERISTIC: 12.00 MILLIAMPERES MAXIMUM SUPPLY

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	16 INPUT
INCLOSURE MATERIAL	METAL OR PLASTIC OR CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
PRECIOUS MATERIAL	GOLD
BODY WIDTH	0.350 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION	LEADED CHIP CARRIER
CURRENT RATING PER CHARACTERISTIC	12.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPE	PAL
CASE OUTLINE SOURCE AND DESIGNATOR	C-2 MIL-M-38510

SUBSTITUTES & CROSS-REFERENCES 4

TIBPAL16R6-30MFKBReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-85155072ASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

5962-85155072XReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-85155Reference document

Same NSN cross-reference

Reference document — Identification reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is PAL16R68-2ML883B?

PAL16R68-2ML883B is a MICROCIRCUIT,MEMORY.

What parts can replace PAL16R68-2ML883B?

There are 4 known substitutes for PAL16R68-2ML883B: TIBPAL16R6-30MFKB, 5962-85155072A, 5962-85155072X and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for PAL16R68-2ML883B?

PAL16R68-2ML883B is cataloged in the U.S. Government catalog under NSN 5962-01-262-2721. This indicates validated use in U.S. government and defense supply chains.

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