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5962-85155072A — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

5962-85155072A: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.350 INCHES MAXIMUM IN, body_length: 0.350 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND BIPOLAR AND PROGRAMMABLE, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, precious_material: GOLD, inclosure_material: METAL OR PLASTIC OR CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-262-2721, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5962-85155072A
NSN: 5962-01-262-2721
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
body_width0.350 INCHES MAXIMUM IN
body_length0.350 INCHES MAXIMUM IN
features_providedMONOLITHIC AND BIPOLAR AND PROGRAMMABLE
output_logic_formBIPOLAR METAL-OXIDE SEMICONDUCTOR
precious_materialGOLD
inclosure_materialMETAL OR PLASTIC OR CERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern16 INPUT
inclosure_configurationLEADED CHIP CARRIER
NSN5962-01-262-2721
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5962-85155072A MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 16 INPUT
•
INCLOSURE MATERIAL: METAL OR PLASTIC OR CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
PRECIOUS MATERIAL: GOLD
•
BODY WIDTH: 0.350 INCHES MAXIMUM IN
•
FEATURES PROVIDED: MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
•
INCLOSURE CONFIGURATION: LEADED CHIP CARRIER
•
CURRENT RATING PER CHARACTERISTIC: 12.00 MILLIAMPERES MAXIMUM SUPPLY
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN16 INPUT
INCLOSURE MATERIALMETAL OR PLASTIC OR CERAMIC
TERMINAL SURFACE TREATMENTSOLDER
PRECIOUS MATERIALGOLD
BODY WIDTH0.350 INCHES MAXIMUM IN
FEATURES PROVIDEDMONOLITHIC AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATIONLEADED CHIP CARRIER
CURRENT RATING PER CHARACTERISTIC12.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPEPAL
CASE OUTLINE SOURCE AND DESIGNATORC-2 MIL-M-38510
SUBSTITUTES & CROSS-REFERENCES 4
TIBPAL16R6-30MFKBReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-85155072XReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-85155Reference document
Same NSN cross-reference
Reference document — Identification reference
PAL16R68-2ML883BReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is 5962-85155072A?
5962-85155072A is a MICROCIRCUIT,MEMORY.
What parts can replace 5962-85155072A?
There are 4 known substitutes for 5962-85155072A: TIBPAL16R6-30MFKB, 5962-85155072X, 5962-85155 and 1 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 5962-85155072A?
5962-85155072A is cataloged in the U.S. Government catalog under NSN 5962-01-262-2721. This indicates validated use in U.S. government and defense supply chains.
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