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Technical Data Sheet
PartsTable / COMPONENT / PAL14H4MJ
PAL14H4MJ ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: BIPOLAR AND PROGRAMMABLE AND MONOLITHIC AND HERMETICALLY SEALED, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, inclosure_material: CERAMIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-184-1162, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
PAL14H4MJ
NSN: 5962-01-184-1162
FSC: 5962
CAGE: 50364 — MMI/AMD (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length1.060 INCHES MAXIMUM IN
features_providedBIPOLAR AND PROGRAMMABLE AND MONOLITHIC AND HERMETICALLY SEALED
output_logic_formBIPOLAR METAL-OXIDE SEMICONDUCTOR
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern28 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-184-1162
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN PAL14H4MJ MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
SPECIFICATION/STANDARD DATA: 81349-MIL-M-38510/503 GOVERNMENT SPECIFICATION
•
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
•
CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES MAXIMUM OUTPUT SINK
•
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
•
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
•
CASE OUTLINE SOURCE AND DESIGNATOR: D-8 MIL-M-38510
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
SPECIFICATION/STANDARD DATA81349-MIL-M-38510/503 GOVERNMENT SPECIFICATION
TIME RATING PER CHACTERISTIC45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
INCLOSURE CONFIGURATIONDUAL-IN-LINE
OUTPUT LOGIC FORMBIPOLAR METAL-OXIDE SEMICONDUCTOR
CURRENT RATING PER CHARACTERISTIC100.00 MILLIAMPERES MAXIMUM OUTPUT SINK
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
CASE OUTLINE SOURCE AND DESIGNATORD-8 MIL-M-38510
FEATURES PROVIDEDBIPOLAR AND PROGRAMMABLE AND MONOLITHIC AND HERMETICALLY SEALED
INCLOSURE MATERIALCERAMIC
VERIFIED SUBSTITUTES & CROSS-REFERENCES 29
5962-3850309BRXInterchangeable
interchangeable cross-reference
interchangeable
PAL16L2Interchangeable
interchangeable cross-reference
interchangeable
7909914-12Interchangeable
interchangeable cross-reference
interchangeable
PAL12L6Interchangeable
interchangeable cross-reference
interchangeable
DMPAL12L6J/883Interchangeable
interchangeable cross-reference
interchangeable
PAL10L8Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusCANCELLED
Availability—
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is PAL14H4MJ?
PAL14H4MJ is a MICROCIRCUIT,MEMORY.
What parts can replace PAL14H4MJ?
There are 29 known substitutes for PAL14H4MJ: 5962-3850309BRX, PAL16L2, 7909914-12 and 26 more. Substitute compatibility should be verified for your specific system.
Is PAL14H4MJ still available?
PAL14H4MJ is currently cancelled.
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Last verified: July 2026