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Technical Data Sheet
PAL12H6 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.410 INCHES MAXIMUM IN, body_height: 0.130 INCHES MAXIMUM IN, body_length: 0.410 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-217-3695, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
PAL12H6
NSN: 5962-01-217-3695
FSC: 5962
CAGE: 50364 — MMI/AMD (USA)
SPECIFICATIONS
body_width0.410 INCHES MAXIMUM IN
body_height0.130 INCHES MAXIMUM IN
body_length0.410 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern12 INPUT
end_item_identificationAN/ALQ-184
NSN5962-01-217-3695
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN PAL12H6 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
INCLOSURE MATERIAL: CERAMIC
TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
BODY HEIGHT: 0.185 INCHES MAXIMUM IN
CASE OUTLINE SOURCE AND DESIGNATOR: D-8 MIL-M-38510
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC AND BIPOLAR AND ELECTROSTATIC SENSITIVE
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TECHNICAL CHARACTERISTICS (FLIS)
INCLOSURE MATERIALCERAMIC
TERMINAL TYPE AND QUANTITY20 PRINTED CIRCUIT
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
BODY HEIGHT0.185 INCHES MAXIMUM IN
CASE OUTLINE SOURCE AND DESIGNATORD-8 MIL-M-38510
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC AND BIPOLAR AND ELECTROSTATIC SENSITIVE
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
END ITEM IDENTIFICATIONAN/ALQ-184
INCLOSURE CONFIGURATIONDUAL-IN-LINE
TERMINAL SURFACE TREATMENTSOLDER
VERIFIED SUBSTITUTES & CROSS-REFERENCES 22
1875914Interchangeable
interchangeable cross-reference
interchangeable
DMPAL12H6J/883Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROM HEAD 082Interchangeable
interchangeable cross-reference
interchangeable
G311478-1Interchangeable
interchangeable cross-reference
interchangeable
M38510/50302BRAInterchangeable
interchangeable cross-reference
interchangeable
5123077-001Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is PAL12H6?
PAL12H6 is a MICROCIRCUIT,DIGITAL.
What parts can replace PAL12H6?
There are 22 known substitutes for PAL12H6: 1875914, DMPAL12H6J/883, ROM/PROM HEAD 082 and 19 more. Substitute compatibility should be verified for your specific system.
What is the NSN for PAL12H6?
PAL12H6 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-217-3695. This indicates validated use in U.S. government and defense supply chains.
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