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Technical Data Sheet
G311478-1 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: BURN IN AND BIPOLAR AND MONOLITHIC AND PROGRAMMED, inclosure_material: CERAMIC, memory_device_type: PAL. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-214-8833, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
G311478-1
NSN: 5962-01-214-8833
FSC: 5962
CAGE: 54X10 — RAYTHEON COMPANY (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length1.060 INCHES MAXIMUM IN
features_providedBURN IN AND BIPOLAR AND MONOLITHIC AND PROGRAMMED
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern12 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-214-8833
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN G311478-1 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 12.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
TERMINAL SURFACE TREATMENT: SOLDER
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
BODY HEIGHT: 0.185 INCHES MAXIMUM IN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.5 VOLTS MINIMUM POWER SOURCE AND 12.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL TYPE AND QUANTITY20 PRINTED CIRCUIT
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
TERMINAL SURFACE TREATMENTSOLDER
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
BODY HEIGHT0.185 INCHES MAXIMUM IN
MEMORY DEVICE TYPEPAL
INCLOSURE CONFIGURATIONDUAL-IN-LINE
VERIFIED SUBSTITUTES & CROSS-REFERENCES 21
1875914Interchangeable
interchangeable cross-reference
interchangeable
DMPAL12H6J/883Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROM HEAD 082Interchangeable
interchangeable cross-reference
interchangeable
PR-G258786-01Interchangeable
interchangeable cross-reference
interchangeable
G258786-101Interchangeable
interchangeable cross-reference
interchangeable
8103502RXInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is G311478-1?
G311478-1 is a MICROCIRCUIT,MEMORY.
What parts can replace G311478-1?
There are 21 known substitutes for G311478-1: 1875914, DMPAL12H6J/883, ROM/PROM HEAD 082 and 18 more. Substitute compatibility should be verified for your specific system.
What is the NSN for G311478-1?
G311478-1 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-214-8833. This indicates validated use in U.S. government and defense supply chains.
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