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Technical Data Sheet
N82S2708N ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.150 INCHES MINIMUM AND 0.205 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND PROGRAMMABLE AND SCHOTTKY, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-168-6559, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
N82S2708N
NSN: 5962-01-168-6559
FSC: 5962
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)
SPECIFICATIONS
body_width0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height0.150 INCHES MINIMUM AND 0.205 INCHES MAXIMUM IN
body_length1.290 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND PROGRAMMABLE AND SCHOTTKY
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC AND GLASS
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern12 INPUT
inclosure_configurationDUAL-IN-LINE
specification/standard_data81349-MIL-M-38510/209 GOVERNMENT SPECIFICATION
time_rating_per_chacteristic50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
NSN5962-01-168-6559
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN N82S2708N MFR MICROCIRCUIT,MEMORY
KEY FEATURES
CASE OUTLINE SOURCE AND DESIGNATOR: D-3 MIL-M-38510
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
BODY LENGTH: 1.290 INCHES MAXIMUM IN
MAXIMUM POWER DISSIPATION RATING: 1.4 WATTS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND PROGRAMMABLE AND SCHOTTKY
INCLOSURE MATERIAL: CERAMIC AND GLASS
TIME RATING PER CHACTERISTIC: 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
CASE OUTLINE SOURCE AND DESIGNATORD-3 MIL-M-38510
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
BODY LENGTH1.290 INCHES MAXIMUM IN
MAXIMUM POWER DISSIPATION RATING1.4 WATTS
OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
FEATURES PROVIDEDHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND PROGRAMMABLE AND SCHOTTKY
INCLOSURE MATERIALCERAMIC AND GLASS
TIME RATING PER CHACTERISTIC50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
BODY WIDTH0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
VERIFIED SUBSTITUTES & CROSS-REFERENCES 27
930173Interchangeable
Ms23f301eak
interchangeable
S82S2708FInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
N82S181FInterchangeable
interchangeable cross-reference
interchangeable
BM1010-700Interchangeable
interchangeable cross-reference
interchangeable
312213-001Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusCANCELLED
Availability
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is N82S2708N?
N82S2708N is a MICROCIRCUIT,MEMORY.
What parts can replace N82S2708N?
There are 27 known substitutes for N82S2708N: 930173, S82S2708F, ROM/PROM and 24 more. Substitute compatibility should be verified for your specific system.
Is N82S2708N still available?
N82S2708N is currently cancelled.
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