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BM1010-700 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

BM1010-700: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.150 INCHES MINIMUM AND 0.205 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND SCHOTTKY AND W/ENABLE AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-108-8797, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
BM1010-700
NSN: 5962-01-108-8797
FSC: 5962 — Microcircuits, Electronic
CAGE: 22915 — NORTHROP GRUMMAN CORP ELECTRONIC SYSTEMS DEFENSIVE SYSTEM DIV (USA)
SPECIFICATIONS
body_width0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height0.150 INCHES MINIMUM AND 0.205 INCHES MAXIMUM IN
body_length1.290 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND SCHOTTKY AND W/ENABLE AND 3-STATE OUTPUT
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern14 INPUT
inclosure_configurationDUAL-IN-LINE
NSN5962-01-108-8797
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN BM1010-700 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 14 INPUT
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.150 INCHES MINIMUM AND 0.205 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND SCHOTTKY AND W/ENABLE AND 3-STATE OUTPUT
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN14 INPUT
INCLOSURE MATERIALCERAMIC AND GLASS
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT0.150 INCHES MINIMUM AND 0.205 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND SCHOTTKY AND W/ENABLE AND 3-STATE OUTPUT
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEROM
CASE OUTLINE SOURCE AND DESIGNATORD-3 MIL-M-38510
SPECIFICATION/STANDARD DATA81349-MIL-M-38510/209 GOVERNMENT SPECIFICATION
SUBSTITUTES & CROSS-REFERENCES 9
N82S181FReference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
312213-001Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
MM6381-1JReference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
01-45240-20Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
4040967-604Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
4014313-01Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
LIFECYCLE
NSN statusActive· U.S. Government catalog
Demilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is BM1010-700?
BM1010-700 is a MICROCIRCUIT,MEMORY.
What parts can replace BM1010-700?
There are 9 known substitutes for BM1010-700: N82S181F, 312213-001, MM6381-1J and 6 more. Substitute compatibility should be verified for your specific system.
What is the NSN for BM1010-700?
BM1010-700 is cataloged in the U.S. Government catalog under NSN 5962-01-108-8797. This indicates validated use in U.S. government and defense supply chains.
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✓ PartsTable — the parts reference. Every fact cited to its source.
PartsTable Design LLC · partstable.com
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.
PartsTable commercial catalog: edition Unified commercial catalog snapshot through 2026-09-28, edition date not on file, retrieved 2026-09-28.