N82S123F: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.302 INCHES MAXIMUM IN, body_height: 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN, body_length: 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: PROGRAMMED AND BIPOLAR AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-045-1025, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.302 INCHES MAXIMUM IN |
| body_height | 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN |
| body_length | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| memory_capacity | UNKNOWN |
| features_provided | PROGRAMMED AND BIPOLAR AND 3-STATE OUTPUT |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | +0.0 TO 70.0 CELSIUS DEGC |
| input_circuit_pattern | 6 INPUT |
| hybrid_technology_type | MONOLITHIC |
| NSN | 5962-01-045-1025 |
| INPUT CIRCUIT PATTERN | 6 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.302 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND MONOLITHIC AND 3-STATE OUTPUT AND BIPOLAR |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | ROM |
| BODY LENGTH | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |