The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_width: 0.165 INCHES NOMINAL IN, overall_height: 0.210 INCHES NOMINAL IN, overall_length: 0.181 INCHES NOMINAL IN, mounting_method: TERMINAL, terminal_length: 0.594 INCHES NOMINAL IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-01-095-5854, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_width | 0.165 INCHES NOMINAL IN |
| overall_height | 0.210 INCHES NOMINAL IN |
| overall_length | 0.181 INCHES NOMINAL IN |
| mounting_method | TERMINAL |
| terminal_length | 0.594 INCHES NOMINAL IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| power_rating_per_characteristic | 280.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| current_rating_per_characteristic | 200.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC |
| voltage_rating_in_volts_per_characteristic | 30.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| maximum_operating_temp_per_measurement_point | 125.0 CELSIUS JUNCTION DEGC |
| NSN | 5961-01-095-5854 |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| MATERIAL | PLASTIC ENCLOSURE |
| MATERIAL | SILICON SEMICONDUCTOR |
| CURRENT RATING PER CHARACTERISTIC | 200.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC |
| POWER RATING PER CHARACTERISTIC | 280.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 30.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| TERMINAL LENGTH | 0.594 INCHES NOMINAL IN |
| OVERALL HEIGHT | 0.210 INCHES NOMINAL IN |
| MOUNTING METHOD | TERMINAL |