A Sandberg Design Cover effectively protects your phone against marks and scratches while also giving it a more personal look. Key specifications include material: SILICON SEMICONDUCTOR, overall_width: 0.165 INCHES NOMINAL IN, overall_height: 0.210 INCHES NOMINAL IN, overall_length: 0.181 INCHES NOMINAL IN, mounting_method: TERMINAL, terminal_length: 0.594 INCHES NOMINAL IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5998-01-430-3709, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_width | 0.165 INCHES NOMINAL IN |
| overall_height | 0.210 INCHES NOMINAL IN |
| overall_length | 0.181 INCHES NOMINAL IN |
| mounting_method | TERMINAL |
| terminal_length | 0.594 INCHES NOMINAL IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| power_rating_per_characteristic | 280.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| current_rating_per_characteristic | 200.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC |
| voltage_rating_in_volts_per_characteristic | 30.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| maximum_operating_temp_per_measurement_point | 125.0 CELSIUS JUNCTION DEGC |
| NSN | 5998-01-430-3709 |