LT1010MK/883 — MICROCIRCUIT,LINEAR

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

LT1010MK/883: MICROCIRCUIT,LINEAR.

The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 1.050 INCHES MAXIMUM IN, body_height: 0.320 INCHES MINIMUM AND 0.350 INCHES MAXIMUM IN, body_length: 1.573 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-362-1122, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

LT1010MK/883

NSN: 5962-01-362-1122
FSC: 5962 — Microcircuits, Electronic
CAGE: 64155 — LINEAR TECHNOLOGY LLC (USA)

SPECIFICATIONS

body_width	1.050 INCHES MAXIMUM IN
body_height	0.320 INCHES MINIMUM AND 0.350 INCHES MAXIMUM IN
body_length	1.573 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	1 INPUT
inclosure_configuration	CAN
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	4 PIN AND 1 CASE
NSN	5962-01-362-1122

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 1 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 BUFFER

•

BODY WIDTH: 1.050 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.320 INCHES MINIMUM AND 0.350 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC

•

INCLOSURE CONFIGURATION: CAN

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	1 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 BUFFER
BODY WIDTH	1.050 INCHES MAXIMUM IN
BODY HEIGHT	0.320 INCHES MINIMUM AND 0.350 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC
INCLOSURE CONFIGURATION	CAN
CURRENT RATING PER CHARACTERISTIC	9.00 MILLIAMPERES MAXIMUM SUPPLY
CASE OUTLINE SOURCE AND DESIGNATOR	TO-3 JOINT ELECTRON DEVICE ENGINEERING COUNCIL

SUBSTITUTES & CROSS-REFERENCES 4

5962-88562Reference document

Same NSN cross-reference

Reference document — Identification reference

5962-8856201YASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

5962-8856201YXReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8856201YBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is LT1010MK/883?

LT1010MK/883 is a MICROCIRCUIT,LINEAR.

What parts can replace LT1010MK/883?

There are 4 known substitutes for LT1010MK/883: 5962-88562, 5962-8856201YA, 5962-8856201YX and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for LT1010MK/883?

LT1010MK/883 is cataloged in the U.S. Government catalog under NSN 5962-01-362-1122. This indicates validated use in U.S. government and defense supply chains.

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