5962-88562: MICROCIRCUIT,LINEAR.
The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 1.050 INCHES MAXIMUM IN, body_height: 0.320 INCHES MINIMUM AND 0.350 INCHES MAXIMUM IN, body_length: 1.573 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-330-5514, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 1.050 INCHES MAXIMUM IN |
| body_height | 0.320 INCHES MINIMUM AND 0.350 INCHES MAXIMUM IN |
| body_length | 1.573 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| body_outside_diameter | 0.350 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN |
| input_circuit_pattern | 1 INPUT |
| inclosure_configuration | CAN |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-330-5514 |
| INPUT CIRCUIT PATTERN | 1 INPUT |
| INCLOSURE MATERIAL | METAL |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY OUTSIDE DIAMETER | 0.350 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN |
| DESIGN FUNCTION AND QUANTITY | 1 BUFFER |
| FEATURES PROVIDED | MONOLITHIC |
| INCLOSURE CONFIGURATION | CAN |
| CASE OUTLINE SOURCE AND DESIGNATOR | TO-39 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| BODY LENGTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |