L537000441 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

L537000441: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.540 INCHES NOMINAL IN, body_height: 0.175 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: LOW POWER AND SYNCHRONOUS AND W/ENABLE AND 3-STATE OUTPUT AND BIDIRECTIONAL, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-151-4881, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

L537000441

NSN: 5962-01-151-4881
FSC: 5962 — Microcircuits, Electronic
CAGE: 36090 — LOCKHEED MARTIN LIBRASCOPE CORPORATION (USA)

SPECIFICATIONS

body_width	0.540 INCHES NOMINAL IN
body_height	0.175 INCHES MAXIMUM IN
body_length	1.290 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	LOW POWER AND SYNCHRONOUS AND W/ENABLE AND 3-STATE OUTPUT AND BIDIRECTIONAL
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	22 INPUT
NSN	5962-01-151-4881

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 22 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.540 INCHES NOMINAL IN

•

BODY HEIGHT: 0.175 INCHES MAXIMUM IN

•

FEATURES PROVIDED: LOW POWER AND SYNCHRONOUS AND W/ENABLE AND 3-STATE OUTPUT AND BIDIRECTIONAL

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	22 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.540 INCHES NOMINAL IN
BODY HEIGHT	0.175 INCHES MAXIMUM IN
FEATURES PROVIDED	LOW POWER AND SYNCHRONOUS AND W/ENABLE AND 3-STATE OUTPUT AND BIDIRECTIONAL
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	1.290 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

HM1-6516/883Reference document

Same NSN cross-reference

Reference document — Secondary reference

HM1-6516-8Reference document

Same NSN cross-reference

Reference document — Secondary reference

B4021524Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is L537000441?

L537000441 is a MICROCIRCUIT,MEMORY.

What parts can replace L537000441?

There are 3 known substitutes for L537000441: HM1-6516/883, HM1-6516-8, B4021524. Substitute compatibility should be verified for your specific system.

What is the NSN for L537000441?

L537000441 is cataloged in the U.S. Government catalog under NSN 5962-01-151-4881. This indicates validated use in U.S. government and defense supply chains.

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