HM1-6516-8 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

HM1-6516-8: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/ENABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-151-4881, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

HM1-6516-8

NSN: 5962-01-151-4881
NIINs: 011514881, 012368472, 013234953
FSC: 5962 — Microcircuits, Electronic
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)

SPECIFICATIONS

body_width	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN
body_length	1.290 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/ENABLE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	22 INPUT
end_item_identification	1270-01-142-2855 TARGET DESIGNAT
NSN	5962-01-151-4881

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 22 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.540 INCHES NOMINAL IN

•

BODY HEIGHT: 0.175 INCHES MAXIMUM IN

•

FEATURES PROVIDED: LOW POWER AND SYNCHRONOUS AND W/ENABLE AND 3-STATE OUTPUT AND BIDIRECTIONAL

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	22 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.540 INCHES NOMINAL IN
BODY HEIGHT	0.175 INCHES MAXIMUM IN
FEATURES PROVIDED	LOW POWER AND SYNCHRONOUS AND W/ENABLE AND 3-STATE OUTPUT AND BIDIRECTIONAL
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	1.290 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

HM1-6516/883Reference document

Same NSN cross-reference

Reference document — Secondary reference

L537000441Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

B4021524Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is HM1-6516-8?

HM1-6516-8 is a MICROCIRCUIT,MEMORY.

What parts can replace HM1-6516-8?

There are 3 known substitutes for HM1-6516-8: HM1-6516/883, L537000441, B4021524. Substitute compatibility should be verified for your specific system.

What is the NSN for HM1-6516-8?

HM1-6516-8 is cataloged in the U.S. Government catalog under NSN 5962-01-151-4881. This indicates validated use in U.S. government and defense supply chains.

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