The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.170 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES MINIMUM IN, overall_diameter: 0.076 INCHES MAXIMUM IN, features_provided: GOLD PLATED LEADS AND HERMETICALLY SEALED CASE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-01-224-6231, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.170 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES MINIMUM IN |
| overall_diameter | 0.076 INCHES MAXIMUM IN |
| features_provided | GOLD PLATED LEADS AND HERMETICALLY SEALED CASE |
| precious_material | GOLD |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| precious_material_and_location | LEADS GOLD |
| power_rating_per_characteristic | 150.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| current_rating_per_characteristic | 10.00 MICROAMPERES NOMINAL REVERSE CURRENT, DC |
| voltage_rating_in_volts_per_characteristic | 35.0 MINIMUM BREAKDOWN VOLTAGE, DC |
| NSN | 5961-01-224-6231 |
| MATERIAL | GLASS ENCLOSURE |
| PRECIOUS MATERIAL AND LOCATION | LEADS GOLD |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| OVERALL LENGTH | 0.170 INCHES MAXIMUM IN |
| OVERALL DIAMETER | 0.076 INCHES MAXIMUM IN |
| FEATURES PROVIDED | GOLD PLATED LEADS AND HERMETICALLY SEALED CASE |
| POWER RATING PER CHARACTERISTIC | 150.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| CURRENT RATING PER CHARACTERISTIC | 10.00 MICROAMPERES NOMINAL REVERSE CURRENT, DC |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 35.0 MINIMUM BREAKDOWN VOLTAGE, DC |
| MOUNTING METHOD | TERMINAL |