The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.170 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES MINIMUM IN, overall_diameter: 0.076 INCHES MAXIMUM IN, features_provided: GOLD PLATED LEADS AND HERMETICALLY SEALED CASE. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-01-064-2504, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.170 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES MINIMUM IN |
| overall_diameter | 0.076 INCHES MAXIMUM IN |
| features_provided | GOLD PLATED LEADS AND HERMETICALLY SEALED CASE |
| precious_material | GOLD |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| precious_material_and_location | LEADS GOLD |
| power_rating_per_characteristic | 150.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| current_rating_per_characteristic | 10.00 MICROAMPERES NOMINAL REVERSE CURRENT, DC |
| voltage_rating_in_volts_per_characteristic | 35.0 MINIMUM BREAKDOWN VOLTAGE, DC |
| NSN | 5961-01-064-2504 |
| OVERALL LENGTH | 1.150 INCHES MINIMUM AND 1.170 INCHES MAXIMUM IN |
| MOUNTING METHOD | TERMINAL |
| MATERIAL | GLASS ENCLOSURE |
| OVERALL DIAMETER | 1.730 INCHES MINIMUM AND 1.930 INCHES MAXIMUM IN |
| TERMINAL LENGTH | 1.000 INCHES NOMINAL IN |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 CELSIUS JUNCTION DEGC |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 35.0 MAXIMUM BREAKDOWN VOLTAGE, DC |
| MATERIAL | SILICON SEMICONDUCTOR |