JBP18S22MJ — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

JBP18S22MJ: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.300 INCHES MAXIMUM IN, body_height: 0.155 INCHES MAXIMUM IN, body_length: 1.010 INCHES MAXIMUM IN, bit_quantity: 2048, word_quantity: 256, memory_capacity: UNKNOWN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-119-4703, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

JBP18S22MJ

NSN: 5962-01-119-4703
NIINs: 011194703, 012053339, 012453447
FSC: 5962 — Microcircuits, Electronic
CAGE: 01295 — TEXAS INSTRUMENTS INCORPORATED (USA)

SPECIFICATIONS

body_width	0.300 INCHES MAXIMUM IN
body_height	0.155 INCHES MAXIMUM IN
body_length	1.010 INCHES MAXIMUM IN
bit_quantity	2048
word_quantity	256
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND SCHOTTKY AND 3-STATE OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
NSN	5962-01-119-4703

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 2048

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

WORD QUANTITY: 256

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.180 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND SCHOTTKY AND PROGRAMMABLE AND PROGRAMMED

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	2048
INPUT CIRCUIT PATTERN	10 INPUT
WORD QUANTITY	256
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
BODY HEIGHT	0.180 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND SCHOTTKY AND PROGRAMMABLE AND PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM

SUBSTITUTES & CROSS-REFERENCES 9

TBP18S22NReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

1101056Reference document

Same NSN cross-reference

Reference document — Secondary reference

912359-1Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

9361125Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

SNJ54S471JReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is JBP18S22MJ?

JBP18S22MJ is a MICROCIRCUIT,MEMORY.

What parts can replace JBP18S22MJ?

There are 9 known substitutes for JBP18S22MJ: TBP18S22N, ROM/PROM, 1101056 and 6 more. Substitute compatibility should be verified for your specific system.

What is the NSN for JBP18S22MJ?

JBP18S22MJ is cataloged in the U.S. Government catalog under NSN 5962-01-119-4703. This indicates validated use in U.S. government and defense supply chains.

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