1101056 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1101056: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 0.930 INCHES MINIMUM AND 0.975 INCHES MAXIMUM IN, bit_quantity: 2048, word_quantity: 256, features_provided: HERMETICALLY SEALED AND SCHOTTKY AND PROGRAMMABLE AND PROGRAMMED. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-119-4703, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1101056

NSN: 5962-01-119-4703
NIINs: 011194703, 015037754
FSC: 5962 — Microcircuits, Electronic
CAGE: K3577 — TYCO ELECTRONICS UK LTD, M/A-COM DIVISION (GBR)

SPECIFICATIONS

body_width	0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
body_height	0.180 INCHES MAXIMUM IN
body_length	0.930 INCHES MINIMUM AND 0.975 INCHES MAXIMUM IN
bit_quantity	2048
word_quantity	256
features_provided	HERMETICALLY SEALED AND SCHOTTKY AND PROGRAMMABLE AND PROGRAMMED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
NSN	5962-01-119-4703

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 2048

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

WORD QUANTITY: 256

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.180 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND SCHOTTKY AND PROGRAMMABLE AND PROGRAMMED

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	2048
INPUT CIRCUIT PATTERN	10 INPUT
WORD QUANTITY	256
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
BODY HEIGHT	0.180 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND SCHOTTKY AND PROGRAMMABLE AND PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM

SUBSTITUTES & CROSS-REFERENCES 9

TBP18S22NReference document

Same NSN cross-reference

Reference document — Secondary reference

JBP18S22MJReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

912359-1Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

9361125Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

SNJ54S471JReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 1101056?

1101056 is a MICROCIRCUIT,MEMORY.

What parts can replace 1101056?

There are 9 known substitutes for 1101056: TBP18S22N, JBP18S22MJ, ROM/PROM and 6 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 1101056?

1101056 is cataloged in the U.S. Government catalog under NSN 5962-01-119-4703. This indicates validated use in U.S. government and defense supply chains.

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