The SEMICONDUCTOR DEVICE SET is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE ALL SEMICONDUCTOR DEVICE DIODE, overall_length: 0.766 INCHES MINIMUM AND 0.792 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN, mounting_method: TERMINAL ALL SEMICONDUCTOR DEVICE DIODE, terminal_length: 0.180 INCHES MINIMUM AND 0.190 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN, overall_diameter: 0.222 INCHES MINIMUM AND 0.240 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN, special_features: A REMOVABLE BASE ADAPTER IS FURNISHED FOR EACH DIODE PRMTDAUA000. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-488-7156, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | GLASS ENCLOSURE ALL SEMICONDUCTOR DEVICE DIODE |
| overall_length | 0.766 INCHES MINIMUM AND 0.792 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN |
| mounting_method | TERMINAL ALL SEMICONDUCTOR DEVICE DIODE |
| terminal_length | 0.180 INCHES MINIMUM AND 0.190 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN |
| overall_diameter | 0.222 INCHES MINIMUM AND 0.240 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN |
| special_features | A REMOVABLE BASE ADAPTER IS FURNISHED FOR EACH DIODE PRMTDAUA000 |
| features_provided | BURN IN AND HERMETICALLY SEALED CASE |
| internal_configuration | POINT CONTACT ALL SEMICONDUCTOR DEVICE DIODE |
| semiconductor_material | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| terminal_type_and_quantity | 2 PIN ALL SEMICONDUCTOR DEVICE DIODE |
| component_name_and_quantity | 2 SEMICONDUCTOR DEVICE DIODE |
| function_for_which_designed | MICROWAVE AND MIXER |
| NSN | 5961-00-488-7156 |
| INTERNAL CONFIGURATION | POINT CONTACT ALL SEMICONDUCTOR DEVICE DIODE |
| MATERIAL | GLASS ENCLOSURE ALL SEMICONDUCTOR DEVICE DIODE |
| COMPONENT FUNCTION RELATIONSHIP | MATCHED |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 CELSIUS AMBIENT AIR ALL SEMICONDUCTOR DEVICE DIODE DEGC |
| INTERNAL JUNCTION CONFIGURATION | PN ALL SEMICONDUCTOR DEVICE DIODE |
| FUNCTION FOR WHICH DESIGNED | MICROWAVE AND MIXER |
| MOUNTING METHOD | TERMINAL ALL SEMICONDUCTOR DEVICE DIODE |
| OVERALL DIAMETER | 0.222 INCHES MINIMUM AND 0.240 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN |
| SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| FEATURES PROVIDED | BURN IN AND HERMETICALLY SEALED CASE |